Product Code: SIKABONDTF+N
SikaBond® -TF plus N is a 1-component, elastic PU-based adhesive for the Sika Membran® system.
SikaBond® -TF plus N is suitable for bonding SikaMembran® on to:
- Aluminium including powder coated
- Most construction materials
- EPDM gaskets to substrates
- Easy, quick application
- Solvent free
- No pre-treatment of membrane needed
- Suitable for uneven substrates
- Highly adaptable
- No additional mechanical fixing
Packaging 600 cc sausages, 20 per box
Storage Conditions /Shelf-Life
12 months from date of production if stored in undamaged original sealedcontainers, in dry conditions and protected from direct sunlight at temperaturesbetween +10°C and +25°C.2
SikaBond® -TF plus N
2/3Technical Data Chemical Base 1-part moisture curing polyurethane Density ~ 1.3 kg/l Skinning Time ~ 90 minutes Curing Rate ~ 3 mm / 24h (+23°C / 50% r. h.)Sag Flow <2.0 mm Service Temperature -40°C to +90°C
Mechanical / Physical Properties
Tensile Strength ~ 1.5 N/mm2Shore A Hardness ~ 25Elongation at Break ~ 600%System Information Application Details Consumption Theoretical consumption of SikaBond® -TF plus N per 600cc sausage (without wastage):Approx. 6-7 linear metres dependant on substrate.Substrate Quality Clean and dry, homogeneous, free from oils and grease, dust and loose or friable particles. Cement laitance, poorly adhering particles and incompatible paints must be removed.Substrate Preparation / Priming Surfaces must be clean, dry and free from oil, grease, dust and loose or friable particles. Paint, cement laitance and any other contaminants must be removed.Clean non-porous surfaces with Sika® Cleaner-205. Clean porous surfaces by brush and/or vacuum. For porous substrates exposed to frequent water contact use Sika® Primer-3 N.
Application Conditions /Limitations
Ambient Temperature +5°C min. / +40°C max.Substrate Humidity Dry Application Instructions Application Method /Tools SikaBond® -TF plus N is supplied ready to use.Only apply SikaBond® -TF plus N after substrate preparation.Insert sausage into sealant gun and cut nozzle to a diameter of not less than 8mm,and firmly extrude bead of adhesive. Spread SikaBond® -TF plus N by means of a spatula to approx 4-5 cm width@ 1mm thickness (dependant on substrate profile).Place SikaMembran® onto the SikaBond® -TF plus N and apply pressure along membrane using a plastic roller. Ensure excess extruded SikaBond® -TF plus N is tooled off by trowel.Optimum bonding will be obtained after complete curing of SikaBond® -TF plus N.Cleaning of Tools Clean all tools and application equipment with Sika® Remover-208 immediately after use. Hardened / cured material can only be removed mechanically.